The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Jan. 08, 2020
Shinko Electric Industries Co., Ltd., Nagano, JP;
Wataru Katayama, Nagano, JP;
Ryota Mitsui, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A stem for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, and a through-hole penetrating the eyelet from the first surface to the second surface, a metal base bonded to the second surface of the eyelet so as to cover one end of the through-hole, and a metal block having one end thereof inserted into the through-hole and bonded to the metal base inside the through-hole, and another end projecting from the first surface of the eyelet and including a device mounting surface on which a semiconductor device is mounted. The metal base has a thermal conductivity higher than or equal to a thermal conductivity of the eyelet, and a surface at the one end of the metal block matches the second surface of the eyelet.