The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Aug. 05, 2020
Applicants:

Foxconn (Kunshan) Computer Connector Co., Ltd., Kunshan, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Chih-Ping Chung, New Taipei, TW;

Chun-Hsiung Hsu, New Taipei, TW;

Kuei-Chung Tsai, New Taipei, TW;

Terrance F. Little, Fullerton, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/652 (2006.01); H01R 12/75 (2011.01); H01R 13/6581 (2011.01); H01R 13/6592 (2011.01); H01R 13/6594 (2011.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 13/405 (2006.01); H01R 13/502 (2006.01); H01R 24/60 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/652 (2013.01); H01R 12/716 (2013.01); H01R 12/721 (2013.01); H01R 12/724 (2013.01); H01R 12/75 (2013.01); H01R 13/405 (2013.01); H01R 13/502 (2013.01); H01R 13/6581 (2013.01); H01R 13/6592 (2013.01); H01R 13/6594 (2013.01); H01R 24/60 (2013.01); H01R 2107/00 (2013.01);
Abstract

An electrical connector assembly comprising: an insulative housing with a front mating slot and a rear receiving cavity; a combo contact module assembly received within the receiving cavity and including a sideband contact module sandwiched between a pair of high speed contact modules; each high speed contact module including an upper unit and a lower unit assembled with each other in a vertical direction; the upper unit and the lower unit being essentially symmetrically arranged with each other in the vertical direction with a half of pitch offset in a transverse direction; and a metallic shell; wherein each of the upper unit and the lower unit including a front subunit and a rear subunit stacked with each other in the vertical direction and retained together.


Find Patent Forward Citations

Chung, Chih-Ping. (2022). Electrical connector assembly with high speed high density symmetrical contact arrangement (U.S. Patent No. 11349262). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11349262

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…