The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Sep. 28, 2018
Intel Corporation, Santa Clara, CA (US);
Maruti Gupta Hyde, Portland, OR (US);
Nageen Himayat, Fremont, CA (US);
Linda Hurd, Cool, CA (US);
Min Suet Lim, Gelugor, MY;
Van Le, Beaverton, OR (US);
Gayathri Jeganmohan, Folsom, CA (US);
Ankitha Chandran, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods and apparatus to implement efficient memory storage in multi-die packages are disclosed. An example multi-die package includes a multi-die stack including a first die and a second die. The second die is stacked on the first die. The multi-die package further includes a third die adjacent the multi-die stack. The multi-die package also includes a silicon-based connector to communicatively couple the multi-die stack and the third die. The silicon-based connector includes at least one of a logic circuit or a memory circuit.