The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Apr. 27, 2017
Applicant:

Calsonic Kansei Corporation, Saitama, JP;

Inventors:

Yutaka Satou, Saitama, JP;

Yasuyuki Ooi, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/31 (2006.01); H01L 29/739 (2006.01); H02M 3/158 (2006.01); H02M 1/32 (2007.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/31 (2013.01); H01L 23/473 (2013.01); H01L 29/7393 (2013.01); H02M 1/32 (2013.01);
Abstract

A semiconductor component includes: a semiconductor device; an insulating molded portion configured to encapsulate the semiconductor device; a terminal connected to the semiconductor device, the terminal being configured to project out from the insulating molded portion; and a cooler mounted with the insulating molded portion such that the semiconductor device is cooled; wherein a recessed portion is formed in a surface of the cooler on which the insulating molded portion is mounted so as to extend from a position facing the terminal to a position at inner side of an end portion of the insulating molded portion.


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