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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11348816 B1

PDFFull Text
Date of Patent:
May. 31, 2022

Filed:

Jul. 22, 2019

Systems and methods for die container warehousing

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Sheng Kuo, Hsin-Chu, TW;

Chih-Hung Huang, Hsin-Chu, TW;

Hsueh-Lei Wang, New Taipei, TW;

Yang-Ann Chu, Hsin-Chu, TW;

Hsuan Lee, Tainan, TW;

Jiun-Rong Pai, Jhubei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Duane Morris LLP

Primary Examiner:

Alia Sabur

Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/673 (2006.01); B65G 1/137 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6773 (2013.01); B65G 1/1373 (2013.01); H01L 21/67326 (2013.01); H01L 21/67333 (2013.01); H01L 21/67706 (2013.01); H01L 21/67724 (2013.01); H01L 21/67745 (2013.01);
Abstract

In an embodiment, a system includes: a warehousing apparatus configured to interface with a semiconductor die processing tool configured to process a semiconductor die singulated from a wafer, wherein the semiconductor die processing tool comprise an in-port and an out-port, wherein the warehousing apparatus is configured to: move a first die vessel that contains the semiconductor die to the in-port from a first die vessel container, wherein the first die vessel container is configured to house the first die vessel; move the first die vessel from the in-port to a buffer region; and move a second die vessel from the buffer region to the out-port.

Find Patent Forward Citations

Kuo, Tsung-Sheng. (2022). Systems and methods for die container warehousing (U.S. Patent No. 11348816). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11348816

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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