The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2022

Filed:

Jan. 11, 2022
Applicant:

Guangdong University of Technology, Guangzhou, CN;

Inventors:

Qiang Liu, Guangzhou, CN;

Lijun Wei, Guangzhou, CN;

Xin Chen, Guangzhou, CN;

Duxi Yan, Guangzhou, CN;

Long Li, Guangzhou, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/39 (2020.01); G06F 30/392 (2020.01); G06F 111/10 (2020.01); G06F 111/04 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 2111/04 (2020.01); G06F 2111/10 (2020.01);
Abstract

A chip layout method based on a minimum total wire length, includes: initializing a total wire length to a preset value, initializing a number of iterations, randomly generating a sequence pair to represent a positional relationship between rectangular circuit modules, inputting the sequence pair to a model, and solving to obtain a sequence pair having a minimum wire length within the number of iterations; changing a field operator of the sequence pair to obtain a new one, inputting the new sequence pair to the model, retaining, if an obtained total wire length is less than the original total wire length, the new sequence pair, or otherwise, abandoning the new sequence pair; repeating the above operation till the number of iterations is reached; and outputting a minimum total wire length, and coordinates of each rectangular circuit module to obtain the chip layout based on the minimum total wire length.


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