The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Oct. 15, 2019
Applicant:
Win Semiconductors Corp., Tao Yuan, TW;
Inventors:
Chih-Wen Huang, Taoyuan, TW;
Jui-Chieh Chiu, Taoyuan, TW;
Assignee:
WIN Semiconductors Corp., Tao Yuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 23/49513 (2013.01); H01L 24/48 (2013.01); H01L 23/66 (2013.01);
Abstract
A power flat no-lead (FN) package is provided. The power FN package includes a die paddle; a die, disposed on the die paddle, operating at a radio frequency; a first lead, disposed by a first side of the die paddle, configured to receive an input signal of the power FN package; and a capacitor, disposed on the first lead; wherein a lead width of the first lead is greater than a half of a first side length of the first side.