The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Oct. 28, 2019
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Kiyohiko Sakakibara, Mie, JP;

Ken Oowada, Fujisawa, JP;

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); G11C 16/08 (2006.01); G11C 16/10 (2006.01); G11C 16/24 (2006.01); H01L 27/11582 (2017.01); G11C 16/34 (2006.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01); G11C 16/26 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
G11C 5/063 (2013.01); G11C 16/08 (2013.01); G11C 16/10 (2013.01); G11C 16/24 (2013.01); G11C 16/26 (2013.01); G11C 16/3459 (2013.01); H01L 21/823487 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01);
Abstract

Methods for reducing manufacturing cost and improving the reliability of non-volatile memories using NAND strings with polysilicon channels and p-type doped source lines are described. A NAND string may include a polysilicon channel that is orthogonal to a substrate and connects to a boron doped source line at a source-side end of the NAND string. To reduce the likelihood of the polysilicon channel being cut-off or pinched near the source-side end of the NAND string, a thicker polysilicon channel may be formed near the source-side end of the NAND string while a thinner polysilicon channel may be formed for the remainder of the NAND string by diffusing boron into a first portion of the polysilicon channel corresponding with the thicker polysilicon channel and then etching the polysilicon channel with etchants that exhibit a reduction in their etch rate at a boron concentration above a threshold concentration.


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