The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 24, 2022

Filed:

Jan. 22, 2022
Applicant:

Monolithic 3d Inc., Klamath Falls, OR (US);

Inventors:

Zvi Or-Bach, Haifa, IL;

Zeev Wurman, Palo Alto, CA (US);

Assignee:

MONOLITHIC 3D INC., Klamath Falls, OR (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/394 (2020.01); G06F 30/327 (2020.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); G06F 30/327 (2020.01); G06F 30/394 (2020.01);
Abstract

A method of designing a 3D Integrated Circuit, including: performing partitioning to at least a logic strata, the logic strata including logic, and to a memory strata, the memory strata including memory; then performing a first placement of the memory strata using a 2D placer executed by a computer, where the 2D placer includes a Computer Aided Design tool, where the 3D Integrated Circuit includes a plurality of connections between the logic and the memory strata; and performing a second placement of the logic strata based on the first placement, where the memory includes a first memory array, where the logic includes a first logic circuit connected so to write data to the first memory array, where the first placement includes placement of the first memory array, and where the second placement includes placement of the first logic circuit based on the placement of the first memory array.


Find Patent Forward Citations

Loading…