The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2022
Filed:
Oct. 30, 2017
Hitachi Chemical Company, Ltd., Tokyo, JP;
Kasumi Nakamura, Tokyo, JP;
Tatsuhito Fukuhara, Tokyo, JP;
Yasunori Kawabata, Tokyo, JP;
Takahide Iwaya, Tokyo, JP;
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Abstract
A resin composition for casting, containing a curable component, a first filler, and a second filler that is different from the first filler, in which a ratio of a major axis of the first filler with respect to a thickness of the first filler is 3 to 25. A molded body including an element and a sealing portion that seals the element, in which the sealing portion contains the resin composition or a cured product thereof.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile