The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Apr. 08, 2020
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Benfu Lin, Singapore, SG;
Kah Wee Gan, Singapore, SG;
Cing Gie Lim, Singapore, SG;
Chengang Feng, Singapore, SG;
Assignee:
GlobalFoundries Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
H01L 23/5228 (2013.01); H01L 25/043 (2013.01);
Abstract
A semiconductor device is provided. A semiconductor device includes a first and a second region, a dielectric layer, a capping layer, and a planar resistive layer. The dielectric layer is arranged over the first and second regions and the capping layer is arranged over the dielectric layer. The capping layer has a substantially planar top surface over the first and second regions. The planar resistive layer is encapsulated within the capping layer in the first device region.