The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Jul. 09, 2020
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Nathan Ip, Austin, TX (US);
Assignee:
Tokyo Electron Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/04 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 21/18 (2006.01); G06F 30/27 (2020.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G06F 30/27 (2020.01); H01L 21/187 (2013.01); H01L 22/20 (2013.01); H01L 24/94 (2013.01); B81C 2203/0118 (2013.01); G05B 2219/37224 (2013.01); H01L 2224/828 (2013.01);
Abstract
A method includes having a first wafer bonding recipe and a model of a wafer bonding process, the model comprising an input indicative of a physical parameter of a first wafer to be bonded to a second wafer and configured to output a wafer bonding recipe based on the physical parameter of the first wafer; obtaining measurements of the first wafer to obtain the physical parameter of the first wafer; generating, by the model, the first wafer bonding recipe based on the physical parameter of the first wafer; and bonding the first wafer to the second wafer in accordance with the first wafer bonding recipe to produce a first post-bond wafer.