The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Sep. 09, 2019
Applicants:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Adeka Corporation, Tokyo, JP;
Inventors:
Gyu-Hee Park, Hwaseong-si, KR;
Takanori Koide, Tokyo, JP;
Yoshiki Manabe, Tokyo, JP;
Masayuki Kimura, Tokyo, JP;
Akio Saito, Tokyo, JP;
Jaesoon Lim, Seoul, KR;
Younjoung Cho, Hwaseong-si, KR;
Assignees:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 5/06 (2006.01); C09D 1/00 (2006.01); C09D 5/00 (2006.01); C23C 16/20 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C07F 5/066 (2013.01); C07F 5/067 (2013.01); C09D 1/00 (2013.01); C09D 5/00 (2013.01); C23C 16/20 (2013.01); H01L 21/0228 (2013.01); H01L 21/02178 (2013.01); H01L 21/02205 (2013.01);
Abstract
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.