The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2022
Filed:
Jul. 07, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Eswaranand Venkatasubramanian, Santa Clara, CA (US);
Samuel E. Gottheim, Santa Clara, CA (US);
Pramit Manna, Sunnyvale, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C01B 32/28 (2017.01); H01L 21/308 (2006.01); C01B 32/26 (2017.01); H01L 21/311 (2006.01); C01B 32/25 (2017.01); H01L 21/033 (2006.01); C23C 16/26 (2006.01); C23C 16/505 (2006.01);
U.S. Cl.
CPC ...
C01B 32/28 (2017.08); C01B 32/25 (2017.08); C01B 32/26 (2017.08); C23C 16/26 (2013.01); C23C 16/505 (2013.01); H01L 21/02115 (2013.01); H01L 21/02205 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01); H01L 21/0332 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/31111 (2013.01); H01L 21/31144 (2013.01);
Abstract
Apparatuses and methods to manufacture integrated circuits are described. A method of forming film on a substrate is described. The film is formed on a substrate by exposing a substrate to a diamond-like carbon precursor having an spcontent of greater than 40 percent. Methods of etching a substrate are described. Electronic devices comprising a diamond-like carbon film are also described.