The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Apr. 21, 2020
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Tomoaki Shibata, Tokyo, JP;
Hanako Yori, Tokyo, JP;
Tomonori Minegishi, Tokyo, JP;
Hidenori Abe, Tokyo, JP;
Takashi Masuko, Tokyo, JP;
Shunsuke Otake, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H05K 3/28 (2006.01); G01P 1/12 (2006.01); H05K 1/03 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); G01P 1/127 (2013.01); H01L 21/56 (2013.01); H05K 1/0393 (2013.01); H05K 3/28 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 25/18 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1434 (2013.01); H05K 1/189 (2013.01); H05K 3/0052 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10151 (2013.01); Y10T 29/4913 (2015.01);
Abstract
A resin film includes a resin composition for forming a flexible resin layer. The resin composition includes an elastomer, a polymerizable compound, and a polymerization initiator. A laminated film includes a base material film, a resin film formed on the base material film, and a protective film attached to the resin film.
Shibata, Tomoaki. (2022). Resin film, and laminated film including base material film, resin film formed on base material film, and protective film attached to resin film (U.S. Patent No. 11330721). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11330721
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile