The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Sep. 28, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Rita H. Wouhaybi, Portland, OR (US);

John Vicente, Roseville, CA (US);

Kirk Smith, Chandler, AZ (US);

Robert Chavez, Phoenix, AZ (US);

Mark Yarvis, Portland, OR (US);

Steven M. Brown, Chandler, AZ (US);

Jeremy Ouillette, Chandler, AZ (US);

Roderick E. Kronschnabel, Chandler, AZ (US);

Matthew J. Schneider, Chandler, AZ (US);

Chris D. Lucero, Chandler, AZ (US);

Atul N. Hatalkar, Chandler, AZ (US);

Sharad Garg, Portland, OR (US);

Casey Rathbone, Banks, OR (US);

Aaron R. Berck, Hillsboro, OR (US);

Xubo Zhang, Fremont, CA (US);

Ron Kuruvilla Thomas, San Jose, CA (US);

Mandeep Shetty, Chandler, AZ (US);

Ansuya Negi, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 5/04 (2006.01); G05B 19/418 (2006.01); G05B 23/02 (2006.01); G06N 3/02 (2006.01); H04L 29/08 (2006.01); H04L 69/40 (2022.01); H04L 67/10 (2022.01); G05B 19/042 (2006.01); G05B 19/05 (2006.01); H04L 41/082 (2022.01); H04L 41/084 (2022.01); H04L 67/04 (2022.01); H04L 67/1042 (2022.01); H04L 67/12 (2022.01); H04L 67/125 (2022.01); H04L 67/565 (2022.01); H04L 67/00 (2022.01); G06F 8/65 (2018.01); G06F 11/20 (2006.01); H04L 41/0668 (2022.01);
U.S. Cl.
CPC ...
H04L 69/40 (2013.01); G05B 19/042 (2013.01); G05B 19/054 (2013.01); G05B 19/41835 (2013.01); G06F 8/65 (2013.01); G06F 11/2023 (2013.01); G06F 11/2033 (2013.01); H04L 41/0668 (2013.01); H04L 41/082 (2013.01); H04L 41/0846 (2013.01); H04L 67/04 (2013.01); H04L 67/10 (2013.01); H04L 67/1048 (2013.01); H04L 67/1051 (2013.01); H04L 67/12 (2013.01); H04L 67/125 (2013.01); H04L 67/2823 (2013.01); H04L 67/34 (2013.01); G05B 2219/1105 (2013.01); G05B 2219/1214 (2013.01); G05B 2219/32043 (2013.01); G05B 2219/33112 (2013.01); G06F 2201/805 (2013.01); G06F 2201/82 (2013.01); G06F 2201/85 (2013.01);
Abstract

Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.


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