The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Feb. 17, 2016
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
David R. Hembree, Boise, ID (US);
Assignee:
MICRON TECHNOLOGY, INC., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 25/065 (2006.01); H01L 23/42 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/053 (2013.01); H01L 23/3107 (2013.01); H01L 23/3675 (2013.01); H01L 23/3677 (2013.01); H01L 23/42 (2013.01); H01L 25/18 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06589 (2013.01);
Abstract
Apparatuses and methods for internal heat spreading for packaged semiconductor die are disclosed herein. An example apparatus may include a plurality of die in a stack, a bottom die supporting the plurality of die, a barrier and a heat spreader. A portion of the bottom die may extend beyond the plurality of die and a top surface of the bottom die extending beyond the plurality of die may be exposed. The barrier may be disposed alongside the plurality of die and the bottom die, and the heat spreader may be disposed over the exposed top surface of the bottom die and alongside the plurality of die.