The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

May. 22, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Christopher J. Jezewski, Portland, OR (US);

Tejaswi K. Indukuri, Boise, ID (US);

Ramanan V. Chebiam, Hillsboro, OR (US);

Colin T. Carver, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/53209 (2013.01); H01L 21/76831 (2013.01); H01L 21/76843 (2013.01); H01L 21/76846 (2013.01); H01L 21/76847 (2013.01); H01L 21/76879 (2013.01); H01L 21/76882 (2013.01); H01L 21/76883 (2013.01); H01L 23/5226 (2013.01); H01L 23/53261 (2013.01); H01L 23/53266 (2013.01); H01L 23/53295 (2013.01); H01L 29/4966 (2013.01); H01L 29/7848 (2013.01); H01L 21/76849 (2013.01); H01L 21/76877 (2013.01); H01L 23/53233 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An embodiment includes a metal interconnect structure, comprising: a dielectric layer disposed on a substrate; an opening in the dielectric layer, wherein the opening has sidewalls and exposes a conductive region of at least one of the substrate and an interconnect line; an adhesive layer, comprising manganese, disposed over the conductive region and on the sidewalls; and a fill material, comprising cobalt, within the opening and on a surface of the adhesion layer. Other embodiments are described herein.


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