The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Mar. 03, 2020
Applicant:

Xilinx, Inc., San Jose, CA (US);

Inventors:

Gamal Refai-Ahmed, Santa Clara, CA (US);

Chi-Yi Chao, New Taipei, TW;

Suresh Ramalingam, Fremont, CA (US);

Hoa Lap Do, San Jose, CA (US);

Anthony Torza, Oakland, CA (US);

Brian D. Philofsky, Longmont, CO (US);

Assignee:

XILINX, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/42 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01);
Abstract

Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.


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