The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2022
Filed:
Jul. 30, 2020
Micron Technology, Inc., Boise, ID (US);
Joseph A. De La Cerda, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A substrate is orientated parallel to a plane and includes pads that are located at a bottom surface of the substrate and external to the electrical device. A first integrated circuit die is orientated parallel to the plane and disposed above the substrate in a vertical direction. The first integrated circuit die is electrically coupled to at least some of the pads of the substrate. A packaging material is disposed above the first integrated circuit die around at least a top surface and side surfaces of the first integrated circuit die. Test pads are orientated parallel to the plane and disposed above the first integrated circuit die in the vertical direction. The test pads are electrically coupled to the first integrated circuit die and encased within the packaging material.