The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Aug. 06, 2020
Applicant:

Fei Company, Hillsboro, OR (US);

Inventors:

Erik Rene Kieft, Eindhoven, NL;

Pleun Dona, Eindhoven, NL;

Jasper Frans Mathijs van Rens, Eindhoven, NL;

Wouter Verhoeven, Eindhoven, NL;

Peter Mutsaers, Eindhoven, NL;

Jom Luiten, Eindhoven, NL;

Ond{hacek over (r)}ej Ba{hacek over (c)}o, Brno, CZ;

Assignee:

FEI Company, Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/04 (2006.01); H01J 37/26 (2006.01); H01P 7/06 (2006.01);
U.S. Cl.
CPC ...
H01J 37/045 (2013.01); H01J 37/26 (2013.01); H01P 7/06 (2013.01); H01J 2237/043 (2013.01);
Abstract

Disclosed herein are radio frequency (RF) cavities and systems including such RF cavities. The RF cavities are characterized as having an insert with at least one sidewall coated with a material to prevent charge build up without affecting RF input power and that is heat and vacuum compatible. One example RF cavity includes a dielectric insert, the dielectric insert having an opening extending from one side of the dielectric insert to another to form a via, and a coating layer disposed on an inner surface of the dielectric insert, the inner surface facing the via, wherein the coating layer has a thickness and a resistivity, the thickness less than a thickness threshold, and the resistivity greater than a resistivity threshold, wherein the thickness and resistivity thresholds are based partly on operating parameters of the RF cavity.


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