Predicting die susceptible to early lifetime failure

Abstract

Semiconductor yield is modeled at the die level to predict die that are susceptible to early lifetime failure (ELF). A first die yield calculation is made from parametric data obtained from wafer testing in a semiconductor manufacturing process. A second die yield calculation is made from die location only. The difference between the first die yield calculation and the second die yield calculation is a prediction delta. Based on an evaluation of the first die yield calculation and the prediction delta, the likelihood of early lifetime failure can be identified and an acceptable level of die loss can be established to remove die from further processing.