The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 10, 2022

Filed:

Jan. 15, 2020
Applicant:

Advantest Corporation, Tokyo, JP;

Inventors:

Takashi Kawashima, Tokyo, JP;

Akihiko Ito, Tokyo, JP;

Keishi Oku, Tokyo, JP;

Natsuki Shiota, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0433 (2013.01); G01R 1/0416 (2013.01); G01R 31/2889 (2013.01); H01L 23/49811 (2013.01); H01L 24/45 (2013.01);
Abstract

The socketcomprises a first contact probewhich has a first end which is to contact with a first terminalof the DUT, a second contact probewhich has a second end which is to contact with a second terminalof the DUT, and an inner housingwhich holds the first and second contact probesso that the first end and the second end are located on substantially the same virtual plane VP, and the length Lof the second contact probeis shorter than the length Lof the first contact probe. The interposercomprises a substratewhich has a through holeinto which the first contact probeis to be inserted, and a wiring patternwhich is disposed on the substrate, and the wiring patternhas a padwith which the second contact probeis to contact.


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