The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Sep. 14, 2020
Applicants:

Foxconn (Kunshan) Computer Connector Co., Ltd., Kunshan, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Chun-Chieh Yang, New Taipei, TW;

Wei-Chih Lin, New Taipei, TW;

Hsiu-Yuan Hsu, New Taipei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H05K 7/20 (2006.01); H01R 13/629 (2006.01); H01R 13/62 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01); G06F 1/20 (2006.01); H01R 12/70 (2011.01); H05K 1/02 (2006.01); H01R 13/533 (2006.01); H01R 13/502 (2006.01);
U.S. Cl.
CPC ...
H01R 12/716 (2013.01); H01R 13/62933 (2013.01); H05K 7/2049 (2013.01); G06F 1/20 (2013.01); H01L 23/367 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/4093 (2013.01); H01R 12/7076 (2013.01); H01R 13/502 (2013.01); H01R 13/533 (2013.01); H01R 13/62 (2013.01); H01R 13/629 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 7/20445 (2013.01); H05K 7/20518 (2013.01);
Abstract

An electrical connector assembly includes a seat unit and a cover unit. The seat unit defines a receiving cavity for receiving the CPU. The cover unit is pivotably mounted upon one end of the seat unit. The cover unit includes a first cover and a second cover surrounding the first cover. The first cover includes a first frame equipped with therein a floating heat sink which is located above and aligned with the receiving cavity. The heat sink forms a pair of side extensions sandwiched between a pair of pressing blocks and the first frame in a vertical direction and essentially downwardly pressed by the pair of pressing blocks of the first cover in a resilient manner. Resilient mechanism is provided between the pressing block and the heat sink to result in a downward force constantly urge the heat sink downwardly against the first frame.


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