logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11322657 B1

PDFFull Text
Date of Patent:
May. 03, 2022

Filed:

Aug. 25, 2020

Flip-chip light emitting device and production method thereof

Applicant:

Quanzhou Sanan Semiconductor Technology Co., Ltd., Nanan, CN;

Inventors:

Weiping Xiong, Xiqing, CN;

Xin Wang, Xiqing, CN;

Zhiwei Wu, Xiqing, CN;

Di Gao, Xiqing, CN;

Chun-I Wu, Xiqing, CN;

Duxiang Wang, Xiqing, CN;

Assignee:

QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Nanan, CN;

Attorney:

Thomas | Horstemeyer, LLP.

Primary Examiner:

Savitri Mulpuri

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/44 (2010.01); H01L 33/30 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/0062 (2013.01); H01L 33/0093 (2020.05); H01L 33/22 (2013.01); H01L 33/30 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A flip-chip light emitting device includes a transparent substrate, an epitaxial light-emitting structure, a transparent bonding layer interposed between the transparent substrate and the light-emitting structure, and a protective insulating layer disposed over the light-emitting structure and the bonding layer. The transparent bonding layer has a smaller-thickness section that has a first contact surface for the protective insulating layer to be disposed thereover, and a larger-thickness section that has a second contact surface meshing with and bonded to a roughened bottom surface of the light-emitting structure. The first contact surface is smaller in roughness than the second contact surface. A method for producing the device is also disclosed.

Find Patent Forward Citations

Xiong, Weiping. (2022). Flip-chip light emitting device and production method thereof (U.S. Patent No. 11322657). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11322657

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…