The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Apr. 17, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Joan Rey Villarba Buot, Escondido, CA (US);
Zhijie Wang, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 25/00 (2006.01); H01G 4/30 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01G 4/30 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 23/49589 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/50 (2013.01); H01L 27/01 (2013.01); H01L 28/40 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01);
Abstract
Certain aspects of the present disclosure generally relate to a modular capacitor array, such as for an integrated circuit package, and methods for fabricating the same. One example integrated circuit package generally includes a package substrate, a semiconductor die disposed above the package substrate, and at least one modular capacitor array disposed below the package substrate. The modular capacitor array may be a pre-packaged array of capacitive elements, such as multi-layer ceramic capacitors (MLCCs).