The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Sep. 28, 2020
Shin-etsu Engineering Co., Ltd., Tokyo, JP;
Shibaura Mechatronics Corporation, Yokohama, JP;
Shunya Kubota, Yokohama, JP;
Emi Matsui, Yokohama, JP;
Katsuhiro Yamazaki, Yokohama, JP;
Yoshikazu Ohtani, Annaka, JP;
Kyouhei Tomioka, Annaka, JP;
SHIN-ETSU ENGINEERING CO., LTD., Tokyo, JP;
SHIBAURA MECHATRONICS CORPORATION, Yokohama, JP;
Abstract
According to one embodiment, a substrate processing apparatus and a substrate processing method that can improve the quality of substrates are provided. The substrate processing apparatus according to one embodiment includes: a tableconfigured to support a processing target W including a substrate W, a ring Wsurrounding a surrounding of the substrate W, and a dicing tape Wadhered to a lower surface of the substrate Wand a lower surface of the ring W, and a liquid supplierconfigured to eject a liquid which does not mix with a processing liquid for processing the substrate Wand which has a specific gravity heavier than the processing liquid to one of an upper surface of the ring Wof the processing target W supported by the tablerotating by the rotation mechanism, an outer circumference end portion of the substrate Wof the processing target W supported by the tablerotating by the rotation mechanism, and between the substrate Wand the ring Wof the processing target W supported by the tablerotating by the rotation mechanism in accordance with a rotation number of the tableto supply the liquid between the substrate Wand the ring Wof the processing target W.