The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Sep. 09, 2020
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventor:

Po-Hsuan Liao, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H05K 3/46 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67346 (2013.01); H01L 21/02008 (2013.01); H01L 21/67132 (2013.01); H05K 3/4673 (2013.01); H05K 3/381 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/1152 (2013.01);
Abstract

A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.


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