The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Nov. 07, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Hiromi Kiyose, Hillsboro, OR (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/02 (2006.01); B08B 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67034 (2013.01); B08B 3/10 (2013.01); H01L 21/02057 (2013.01); H01L 21/02101 (2013.01); H01L 21/67051 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67253 (2013.01); H01L 21/67742 (2013.01);
Abstract

A substrate processing apparatus includes a liquid film forming unitA configured to form a liquid film of a liquid for anti-drying on a substrate; a drying processing unitB configured to dry the substrate; and a transfer mechanismconfigured to transfer the substrate from the liquid film forming unit into the drying processing unit. By a transfer time adjusting operation of adjusting a volatilization amount of the liquid during a transfer of the substrate by adjusting a transfer time during which the substrate is transferred from the liquid film forming unit into the drying processing unit or by an initial liquid film thickness adjusting operation of adjusting a thickness of the liquid film formed in the liquid film forming unit, the thickness of the liquid film when a drying processing is begun in the drying processing unit is controlled to fall within a target range.


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