The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Apr. 16, 2020
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Hiroaki Kodama, Ogaki, JP;

Kazuro Nishiwaki, Ogaki, JP;

Kazuhiko Kuranobu, Ogaki, JP;

Hiroaki Uno, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 27/28 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 49/02 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H01F 41/041 (2013.01); H01F 27/2804 (2013.01); H01F 27/288 (2013.01); H01L 21/486 (2013.01); H01L 21/4864 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 28/10 (2013.01); H05K 3/42 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.


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