The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Feb. 05, 2021
Applicant:
Kla Corporation, Milpitas, CA (US);
Inventors:
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 9/00 (2006.01); G03F 7/20 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); G03F 7/705 (2013.01); G03F 9/7076 (2013.01); H01L 27/0274 (2013.01);
Abstract
The method for manufacturing an integrated circuit includes: obtaining measurement data according to a first group of overlay marks on a first wafer, where the first group of overlay marks are disposed in a first region on the first wafer; obtaining a first parameter set according to a first model and the measurement data; and projecting the first parameter set into a second region on a second wafer to obtain simulated compensation data, where the second region includes a second group of overlay marks whose quantity is greater than that of the first group of overlay marks.