The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Aug. 31, 2018
Applicant:

Cooler Master Co., Ltd., New Taipei, TW;

Inventors:

Lei-Lei Liu, New Taipei, TW;

Xiao-Min Zhang, New Taipei, TW;

Jen-Chih Cheng, New Taipei, TW;

Assignee:

COOLER MASTER CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 21/08 (2006.01);
U.S. Cl.
CPC ...
F28D 15/046 (2013.01); F28D 15/0233 (2013.01); F28D 15/0275 (2013.01); F28F 21/081 (2013.01); F28F 2240/00 (2013.01); F28F 2255/18 (2013.01);
Abstract

A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.


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