The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 03, 2022

Filed:

Jan. 30, 2020
Applicants:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

The Board of Trustees of the University of Illinois, Champaign, IL (US);

Inventors:

Shailesh N. Joshi, Ann Arbor, MI (US);

Paul Braun, Champaign, IL (US);

Gaurav Singhal, Maharashtra, IN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/48 (2006.01); C25D 5/56 (2006.01); C25D 5/02 (2006.01); H01L 23/00 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
C25D 5/48 (2013.01); C25D 5/02 (2013.01); C25D 5/56 (2013.01); C25D 7/12 (2013.01); H01L 24/27 (2013.01); H01L 2224/03462 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/161 (2013.01);
Abstract

Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.


Find Patent Forward Citations

Loading…