The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Mar. 26, 2019
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
SHOWA DENKO MATERIALS CO., LTD, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/16 (2006.01); B32B 27/18 (2006.01); B32B 27/38 (2006.01); C09D 163/00 (2006.01); C09D 163/04 (2006.01); C08G 59/22 (2006.01); C08G 59/24 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08L 63/00 (2006.01); H05K 1/03 (2006.01); C08G 59/38 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); B32B 27/16 (2013.01); B32B 27/18 (2013.01); B32B 27/38 (2013.01); C08G 59/22 (2013.01); C08G 59/24 (2013.01); C08G 59/38 (2013.01); C08G 59/4223 (2013.01); C08G 59/4276 (2013.01); C08G 59/68 (2013.01); C08L 63/00 (2013.01); H05K 1/0306 (2013.01); H05K 1/0353 (2013.01); B32B 2457/08 (2013.01); H05K 3/46 (2013.01);
Abstract
By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.