The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Dec. 28, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Chandramouleeswaran Subramani, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 7/18 (2006.01); C07F 7/08 (2006.01); C23C 16/18 (2006.01); H01L 23/31 (2006.01); H01L 21/822 (2006.01); H01L 23/498 (2006.01); C23C 18/52 (2006.01); C23C 18/18 (2006.01);
U.S. Cl.
CPC ...
C07F 7/1804 (2013.01); C07F 7/081 (2013.01); C23C 16/18 (2013.01); C23C 18/52 (2013.01); H01L 21/822 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); C23C 18/1879 (2013.01);
Abstract
An integrated circuit (IC) package comprising a substrate having a dielectric, a first structure over at least a portion of the dielectric, the first structure comprising a molecular compound having a ligand coordinating moiety and a second structure over at least a portion of the first structure, the second structure comprising a metal, wherein the first structure is chemically bonded to the dielectric.
Subramani, Chandramouleeswaran. (2022). Site-selective metal plating onto a package dielectric (U.S. Patent No. 11319334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11319334
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile