The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2022
Filed:
Jun. 13, 2018
Government of the United States, As Represented BY the Secretary of the Air Force, Wright-Patterson AFB, OH (US);
Steven B Fairchild, Beavercreek, OH (US);
Daniel P Gortat, Cambridge, GB;
William O'Neill, Cambridge, GB;
Martin R Sparkes, Cambridge, GB;
United States of America as represented by the Secretary of the Air Force, Wright-Patterson AFB, OH (US);
Abstract
A method for reducing outgassing from a metal surface comprises applying energy from an energy source to the metal surface sufficient to melt the metal surface; and allowing the metal surface to re-solidify, wherein the re-solidified metal surface comprises larger grains and fewer grain boundaries, reducing outgassing sites for a trapped gas. Applying energy from an energy source is performed in a raster scan pattern. Adjacent passes in the raster scan pattern overlap sufficiently to melt the entire metal surface. The energy source is a laser, such as a CW Yb fiber laser. A spot size and applied energy of the laser energy source applied to the metal surface is sufficient to melt the entire metal surface (appropriate for the absorption and reflection characteristics of the treated material). The application of energy from an energy source releases at least some of a gas trapped in the metal. The trapped gas is atomic hydrogen. The metal surface comprises an electrode of a high power system device. The metal surface is in one of a high-vacuum environment and a vacuum electronic device. The metal surface comprises at least one of steel, stainless steel, nickel, and copper.