The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Sep. 13, 2020
Ap Memory Technology Corp., Hsinchu County, TW;
Wenliang Chen, Hsinchu County, TW;
Lin Ma, Hsinchu County, TW;
Alessandro Minzoni, Hsinchu County, TW;
AP Memory Technology Corp., Zhubei, TW;
Abstract
A method of assembling a microelectronic package includes the step of: stacking a processing device vertically with at least one memory device and electrically connecting the processing device to a plurality of conductive interconnects of one of the at least one memory device, wherein each of the at least one memory device includes: a substrate, presenting a front surface and a back surface; and a plurality of memory units formed on the front surface, each of which comprises a plurality of memory cells and the conductive interconnects electrically connected to the memory cells; and arranging the conductive interconnects to contribute to a plurality of signal channels each of which dedicated to transmit signals from the processing device to one of the memory units and vice versa.