The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Sep. 21, 2017
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Dominik Zinner, Zell an der Pram, AT;
Thomas Wagenleitner, Aurolzmunster, AT;
Jurgen Markus Suss, Scharding, AT;
Thomas Plach, St. Florian am Inn, AT;
Jurgen Mallinger, Senftenbach, AT;
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Abstract
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.