The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jul. 28, 2020
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Tiburcio Maldo, Consolacion, PH;
Keunhyuk Lee, Suzhou, CN;
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
In a general aspect, a method can include coupling a semiconductor component to a leadframe. The leadframe can include a socket member having a first end portion and a second end portion. The socket member can further include an opening disposed between the first end portion and the second end portion. The opening of the socket member can be configured to receive a solderless pin. The method can also include encapsulating, in a molding compound, at least a portion of the leadframe and at least a portion of the semiconductor component such that the opening of the socket member is exposed through the molding compound.