The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Aug. 19, 2020
Fuji Electric Co., Ltd., Kawasaki, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Ryoichi Kato, Matsumoto, JP;
Hiromichi Gohara, Matsumoto, JP;
Yoshinari Ikeda, Matsumoto, JP;
Yoshikazu Takahashi, Sendai, JP;
Kuniteru Mihara, Tokyo, JP;
Isao Takahashi, Tokyo, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Abstract
A semiconductor device, including a conductive plate having a front surface that includes a plurality of bonding regions and a plurality of non-bonding regions in peripheries of the bonding regions, a plurality of semiconductor elements mounted on the conductive plate in the bonding regions, and a resin encapsulating therein at least the plurality of semiconductor elements and the front surface of the conductive plate. The conductive plate has, at the front surface thereof in the non-bonding regions, a plurality of holes.