The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Jul. 22, 2019
International Business Machines Corporation, Armonk, NY (US);
Mukta G. Farooq, Hopewell Junction, NY (US);
James J. Kelly, Schenectady, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A method for fabricating a dual redistribution layer (RDL) interposer structure is provided. The method includes etching a semiconductor substrate to expose natural crystallographic planes to form trenches. The method also includes depositing conductive material within the trenches of the etched semiconductor substrate to form vias for an interposer structure. The method includes placing back end of line (BEOL) inter-chip wiring on a top side of the interposer structure using a first RDL. The method includes exposing the vias on a back side of the interposer structure. The method further includes forming power RDLs on a back side of the interposer structure using conductive lines in a dielectric layer.