The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 26, 2022

Filed:

Feb. 05, 2020
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Erh-Kun Lai, Taichung, TW;

Hsiang-Lan Lung, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/764 (2006.01); H01L 27/11582 (2017.01); H01L 23/528 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/764 (2013.01); H01L 21/02636 (2013.01); H01L 21/31111 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01); H01L 27/11582 (2013.01); H01L 29/40117 (2019.08);
Abstract

A three-dimensional memory device includes a substrate, a plurality of horizontal conductive layers, a plurality of vertical memory structures and a vertical conductive post. The conductive layers are located above the substrate, and immediately-adjacent two of the conductive layers are spaced by a first air gap. The memory structures pass through the conductive layers and are connected to the substrate. The conductive post is located between immediately-adjacent two of the memory structures and passes through the conductive layers and is connected to the substrate. The conductive post is spaced from immediately-adjacent edges of the conductive layers by a second air gap.


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