The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2022
Filed:
Aug. 15, 2017
Mitsubishi Materials Corporation, Tokyo, JP;
Keiichiro Oishi, Osaka, JP;
Kouichi Suzaki, Osaka, JP;
Shinji Tanaka, Osaka, JP;
Yoshiyuki Goto, Osaka, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
This free-cutting copper alloy contains more than 77.0% but less than 81.0% Cu, more than 3.4% but less than 4.1% Si, 0.07% to 0.28% Sn, 0.06% to 0.14% P, and more than 0.02% but less than 0.25% Pb, with the remainder being made up of Zn and unavoidable impurities. The composition satisfies the following relations: 1.0≤f0=100×Sn/(Cu+Si+0.5×Pb+0.5×P−75.5)≤3.7, 78.5≤f1=Cu+0.8×Si−8.5×Sn+P+0.5×Pb≤83.0, 61.8≤f2=Cu−4.2×Si−0.5×Sn−2×P≤63.7. The area ratios (%) of the constituent phases satisfy the following relations, 36≤κ≤72, 0≤γ≤2.0, 0≤β≤0.5, 0≤μ≤2.0, 96.5≤f3=α+κ, 99.4≤f4=α+κ+γ+μ, 0≤f5=γ+μ≤3.0, 38≤f6=κ+6×γ+0.5×μ≤80. The long side of the γ phase does not exceed 50 μm, and the long side of the μ phase does not exceed 25 μm.