The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Jul. 14, 2020
Qualcomm Incorporated, San Diego, CA (US);
Stanley Seungchul Song, San Diego, CA (US);
Jonghae Kim, San Diego, CA (US);
Periannan Chidambaram, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
An integrated circuit (IC) package is described. The IC package includes a metallization structure. The IC package also includes a first die in a package substrate layer. The package substrate includes a first surface and a second surface, opposite the first surface. The second surface of the package substrate layer is on the metallization structure. The IC package further includes a second die on the first surface of the package substrate layer and on the first die. The IC package also includes through vias in the package substrate layer to couple pads of the second die to metal routing layers at a first surface of the metallization structure. The IC package further includes package bumps on a second surface of the metallization structure, opposite the first surface, and coupled to the pads of the second die through the metal routing layers.