The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Dec. 21, 2020
Applicant:
Dspace Digital Signal Processing and Control Engineering Gmbh, Paderborn, DE;
Inventors:
Assignee:
dSPACE digital signal processing and control engineering GmbH, Paderborn, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/2039 (2013.01); H05K 7/20518 (2013.01); H05K 2201/066 (2013.01);
Abstract
A heat sink with a first sub-area and a second sub-area, designed for contacting a large area of a printed circuit board populated with electronic components. A thermal isolation extends between the first sub-area and the second sub-area, and a rigid mechanical connection that spans the thermal isolation connects the first sub-area to the second sub-area. As a result, the heat sink allows an assignment of sub-areas to electronic components on the printed circuit board, and contributes to mechanical stabilization of the printed circuit board.