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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11310457 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Oct. 25, 2019

Display device and method for manufacturing the same

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Satoshi Murakami, Kanagawa, JP;

Motomu Kurata, Kanagawa, JP;

Hiroyuki Hata, Tochigi, JP;

Mitsuhiro Ichijo, Tochigi, JP;

Takashi Ohtsuki, Kanagawa, JP;

Aya Anzai, Kanagawa, JP;

Masayuki Sakakura, Kanagawa, JP;

Assignee:

SEMICONDUCTOR ENERGY LABORATORY CO., LTD., Kanagawa-ken, JP;

Attorneys:

Nixon Peabody LLP

Jeffrey L. Costellia

Primary Examiner:

Meiya Li

Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 29/04 (2006.01); H01L 29/15 (2006.01); H01L 31/036 (2006.01); H04N 5/655 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 33/60 (2010.01); G06F 3/02 (2006.01); H04N 5/64 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H04N 5/655 (2013.01); G06F 3/02 (2013.01); H01L 27/12 (2013.01); H01L 27/124 (2013.01); H01L 27/1214 (2013.01); H01L 27/1222 (2013.01); H01L 27/1248 (2013.01); H01L 27/3244 (2013.01); H01L 27/3258 (2013.01); H01L 27/3276 (2013.01); H01L 33/60 (2013.01); H01L 51/5246 (2013.01); H04N 5/642 (2013.01); H01L 51/0005 (2013.01); H01L 51/56 (2013.01); H01L 2224/4847 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5323 (2013.01);
Abstract

The present invention provides a method for manufacturing a highly reliable display device at a low cost with high yield. According to the present invention, a step due to an opening in a contact is covered with an insulating layer to reduce the step, and is processed into a gentle shape. A wiring or the like is formed to be in contact with the insulating layer and thus the coverage of the wiring or the like is enhanced. In addition, deterioration of a light-emitting element due to contaminants such as water can be prevented by sealing a layer including an organic material that has water permeability in a display device with a sealing material. Since the sealing material is formed in a portion of a driver circuit region in the display device, the frame margin of the display device can be narrowed.

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