The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Dec. 01, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Naoyuki Ohse, Matsumoto, JP;

Takahito Kojima, Matsumoto, JP;

Yuichi Hashizume, Matsumoto, JP;

Takafumi Uchida, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 21/04 (2006.01); H01L 29/16 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 29/47 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 21/0485 (2013.01); H01L 21/0495 (2013.01); H01L 29/1608 (2013.01); H01L 29/45 (2013.01); H01L 29/47 (2013.01); H01L 29/6606 (2013.01);
Abstract

A semiconductor device having, in a plan view, a termination region surrounding an active region. The semiconductor device includes a semiconductor substrate containing silicon carbide, a first-conductivity-type region provided in the semiconductor substrate at its first main surface, a plurality of first second-conductivity-type regions selectively formed in the semiconductor substrate at its first main surface, a plurality of silicide films respectively in ohmic contact with the first second-conductivity-type regions, a first electrode that is in contact with the silicide films to form ohmic regions, with the first second-conductivity-type regions to form non-operating regions, and with the first-conductivity-type region to form Schottky regions, a second electrode provided at a second main surface of the semiconductor substrate, and a second second-conductivity-type region provided in the termination region. The ohmic regions, the non-operating regions and the Schottky regions are formed in the active region in a striped pattern. The second second-conductivity-type region connects the ohmic regions and the non-operating regions.


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