The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

Mar. 05, 2020
Applicant:

Sandisk Technologies Llc, Addison, TX (US);

Inventors:

Fumitaka Amano, Yokkaichi, JP;

Yosuke Kita, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); H01L 29/45 (2013.01); H01L 29/66492 (2013.01); H01L 29/7833 (2013.01);
Abstract

A semiconductor structure includes a semiconductor channel of a first conductivity type located between a first and second active regions having a doping of a second conductivity type that is opposite of the first conductivity type, a gate stack structure that overlies the semiconductor channel, and includes a gate dielectric and a gate electrode, a first metal-semiconductor alloy portion embedded in the first active region, and a first composite contact via structure in contact with the first active region and the first metal-semiconductor alloy portion, and contains a first tubular liner spacer including a first annular bottom surface, a first metallic nitride liner contacting an inner sidewall of the first tubular liner spacer and having a bottom surface that is located above a horizontal plane including bottom surface of the first tubular liner spacer, and a first metallic fill material portion embedded in the first metallic nitride liner.


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