The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2022
Filed:
Jun. 02, 2020
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Shanghai Huali Integrated Circuit Corporation, Shanghai, CN;
Abstract
The present disclosure discloses a method for detecting a wafer backside defect, comprising: Step 1, providing a signal database comprising signal data corresponding to various different defects, the defects comprising convex defects and concave defects, the signal data reflecting 3D information of the corresponding defect; Step 2, performing backside scanning on a tested wafer by using oblique incident light, and collecting corresponding emitted and scattered light data; and Step 3, comparing the collected emitted and scattered light data with the signal data, and fitting a defect 3D distribution map of the backside of the tested wafer. The present disclosure can test the height or depth of a wafer backside defect and form a 3D distribution map of the wafer backside defect, which is beneficial for analyzing the source of the wafer backside defect and processing it in time, reducing the troubleshooting time and improving the product yield.