The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2022

Filed:

May. 04, 2020
Applicant:

Cooler Master Co., Ltd., New Taipei, TW;

Inventors:

Chang-Han Tsai, New Taipei, TW;

Shui-Fa Tsai, New Taipei, TW;

Assignee:

COOLER MASTER CO., LTD., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F28D 9/00 (2006.01); F28F 3/02 (2006.01); F28F 3/12 (2006.01); H05K 7/20 (2006.01); F28F 21/08 (2006.01); H01L 23/473 (2006.01); B23P 15/26 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
F28D 9/0062 (2013.01); B23P 15/26 (2013.01); F28F 3/025 (2013.01); F28F 3/12 (2013.01); F28F 21/084 (2013.01); F28F 21/089 (2013.01); H01L 23/473 (2013.01); H05K 7/20218 (2013.01); H05K 7/20263 (2013.01); F28F 2245/00 (2013.01); F28F 2275/04 (2013.01); F28F 2280/06 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01);
Abstract

The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin. The disclosure also relates to a method for making the liquid cooling heat exchanger.


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